Silicon interposer with integrated antenna array for millimeter-wave short-range communications

L. Dussopt; Y. Lamy; S. Joblot; J. Lanteri; H. Salti; P. Bar; H. Sibuet; B. Reig; J. F. Carpentier; C. Dehos; P. Vincent

doi:10.1109/MWSYM.2012.6259424

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

L. Dussopt
, Y. Lamy
, S. Joblot
, J. Lanteri
, H. Salti
, P. Bar
, H. Sibuet
, B. Reig
, J. F. Carpentier
, C. Dehos
, P. Vincent

Australian University - Kuwait

نتاج البحث › مراجعة النظراء

25 اقتباسات (Scopus)

ملخص

A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

اللغة الأصلية	English
عنوان منشور المضيف	IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium
المعرِّفات الرقمية للأشياء	https://doi.org/10.1109/MWSYM.2012.6259424
حالة النشر	Published - 2012
الحدث	2012 IEEE MTT-S International Microwave Symposium, IMS 2012 - Montreal, QC المدة: 17 يونيو 2012 → 22 يونيو 2012

سلسلة المنشورات

الاسم	IEEE MTT-S International Microwave Symposium Digest
رقم المعيار الدولي للدوريات (المطبوع)	0149-645X

Conference

Conference	2012 IEEE MTT-S International Microwave Symposium, IMS 2012
الدولة/الإقليم	Canada
المدينة	Montreal, QC
المدة	17/06/12 → 22/06/12

أهداف الأمم المتحدة للتنمية المستدامة

يساهم هذا المخرج في تحقيق أهداف الأمم المتحدة للتنمية المستدامة التالية (SDGs)

Industry innovation and infrastructure

Funding Agency

Kuwait Foundation for the Advancement of Sciences

الوصول إلى المستند

10.1109/MWSYM.2012.6259424

الملفات والروابط الأخرى

https://www.scopus.com/pages/publications/84866782526

قم بذكر هذا

Dussopt, L., Lamy, Y., Joblot, S., Lanteri, J., Salti, H., Bar, P., Sibuet, H., Reig, B., Carpentier, J. F., Dehos, C., & Vincent, P. (2012). Silicon interposer with integrated antenna array for millimeter-wave short-range communications. في IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium المقال 6259424 (IEEE MTT-S International Microwave Symposium Digest). https://doi.org/10.1109/MWSYM.2012.6259424

@inproceedings{fe7c129b695f465ebc4862867fc2f099,

title = "Silicon interposer with integrated antenna array for millimeter-wave short-range communications",

abstract = "A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.",

keywords = "Antenna arrays, Integrated circuit packaging, Millimeter wave communication, Millimeter-wave technology, Silicon, Wafer-scale integration",

author = "L. Dussopt and Y. Lamy and S. Joblot and J. Lanteri and H. Salti and P. Bar and H. Sibuet and B. Reig and Carpentier, \{J. F.\} and C. Dehos and P. Vincent",

note = "Funding Information: The authors wish to gratefully acknowledge the partially funding of these studies by Kuwait Fund for the Advancement of Sciences (KFAS).; 2012 IEEE MTT-S International Microwave Symposium, IMS 2012 ; Conference date: 17-06-2012 Through 22-06-2012",

year = "2012",

doi = "10.1109/MWSYM.2012.6259424",

language = "English",

isbn = "9781467310871",

series = "IEEE MTT-S International Microwave Symposium Digest",

booktitle = "IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium",

}

Dussopt, L, Lamy, Y, Joblot, S, Lanteri, J, Salti, H, Bar, P, Sibuet, H, Reig, B, Carpentier, JF, Dehos, C & Vincent, P 2012, Silicon interposer with integrated antenna array for millimeter-wave short-range communications. في IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium., 6259424, IEEE MTT-S International Microwave Symposium Digest, 2012 IEEE MTT-S International Microwave Symposium, IMS 2012, Montreal, QC, Canada, 17/06/12. https://doi.org/10.1109/MWSYM.2012.6259424

TY - GEN

T1 - Silicon interposer with integrated antenna array for millimeter-wave short-range communications

AU - Dussopt, L.

AU - Lamy, Y.

AU - Joblot, S.

AU - Lanteri, J.

AU - Salti, H.

AU - Bar, P.

AU - Sibuet, H.

AU - Reig, B.

AU - Carpentier, J. F.

AU - Dehos, C.

AU - Vincent, P.

N1 - Funding Information: The authors wish to gratefully acknowledge the partially funding of these studies by Kuwait Fund for the Advancement of Sciences (KFAS).

PY - 2012

Y1 - 2012

N2 - A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

AB - A 60 GHz cavity-backed antenna array integrated on high-resistivity silicon is demonstrated. The antenna design makes use of Through-Silicon-Vias (TSV), silicon micromachining, and wafer-to-wafer bonding to meet the bandwidth and radiation gain requirements for short-range multi-Gbps communications. The fabrication process is presented. Simulated and experimental results show that the antenna element covers easily the 57-66 GHz standard band with good impedance matching and more than 5 dBi of gain. Several fixed-beam four-element antenna arrays demonstrate the capabilities for beam-steering across a range up to ±60°.

KW - Antenna arrays

KW - Integrated circuit packaging

KW - Millimeter wave communication

KW - Millimeter-wave technology

KW - Silicon

KW - Wafer-scale integration

UR - https://www.scopus.com/pages/publications/84866782526

U2 - 10.1109/MWSYM.2012.6259424

DO - 10.1109/MWSYM.2012.6259424

M3 - Conference contribution

AN - SCOPUS:84866782526

SN - 9781467310871

T3 - IEEE MTT-S International Microwave Symposium Digest

BT - IMS 2012 - 2012 IEEE MTT-S International Microwave Symposium

T2 - 2012 IEEE MTT-S International Microwave Symposium, IMS 2012

Y2 - 17 June 2012 through 22 June 2012

ER -

Silicon interposer with integrated antenna array for millimeter-wave short-range communications

ملخص

سلسلة المنشورات

Conference

أهداف الأمم المتحدة للتنمية المستدامة

Funding Agency

الوصول إلى المستند

الملفات والروابط الأخرى

بصمة

قم بذكر هذا